Hello my friend, in this master class I presented my complete flow on fabrication of a MEMRISTOR, starting from the very basics—what a memristor is, why it is a two-terminal non-volatile passive component, and how it “remembers” past voltage. I also explained it with my simple pipe example: once you change the diameter, it retains that state even after the flow stops—same idea with resistance retention when power is cut off. Then I moved into why I am focusing on metal-oxide/hexaferrite based memristors and specifically strontium/barium hexaferrite materials, because these are promising for electrical + structural properties and future memory/neuromorphic applications. After that, I went step-by-step into sputtering (PVD) for thin-film deposition—RF vs DC sputtering, the operating parameters (gas flow, pressure, temperature, time, film thickness, uniformity, deposition rate), and the exact practical sequence: mains + chiller, vent closed, vacuum creation, argon gas (non-reactive), plasma generation, deposition on substrate, and proper shutdown/cleaning. I also covered the device stack (ITO coated PET bottom electrode, hexaferrite active layer, silver paste top electrode) and how I evaluate performance using IV characteristics (bipolar switching + hysteresis loop) and XRD (to confirm crystallinity like M-type hexaferrite). My key takeaway: in my trials, DC sputtering was easier and safer for the target, and a 6-minute sputter gave me the clean bipolar switching compared to noisy longer sputter times.